Characterization of alloys and liquidus projections of ternary Bi-Sb-Sn system

dc.contributor.author	Minic D.
dc.contributor.author	Kolarevic, Milan
dc.contributor.author	Manasijevic D.
dc.contributor.author	Ćosović V.
dc.contributor.author	Živković D.
dc.contributor.author	Talijan N.
dc.contributor.author	Markovic M.
dc.date.accessioned	2021-04-20T14:08:55Z
dc.date.available	2021-04-20T14:08:55Z
dc.date.issued	2012
dc.description.abstract	Given that Sn-based lead-free solders are considered as possible substitution for standard lead-tin solders, properties of the alloys from ternary Bi-Sb-Sn system were characterized by microstructural SEM-EDS analysis, Brinell hardness tests, and electrical conductivity measurements. Isothermal cross section at 298 K and liquidus surface projection were calculated by application of CALPHAD method and software package PANDAT 8.1. The experimentally determined phase compositions in analyzed microstructures were found to be in a good agreement with phases on calculated cross sections. Copyright © 2012 De Gruyter.
dc.identifier.doi	10.1515/htmp.2011.124
dc.identifier.issn	0334-6455
dc.identifier.scopus	2-s2.0-84860129419
dc.identifier.uri	https://scidar.kg.ac.rs/handle/123456789/9823
dc.rights	restrictedAccess
dc.source	High Temperature Materials and Processes
dc.title	Characterization of alloys and liquidus projections of ternary Bi-Sb-Sn system
dc.type	article

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